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Huawei unveils new chip for flagship phone

September 7, 2019
 

Photo: AFP

Huawei unveiled the Kirin 990 chipset at the IFA 2019 in Berlin. This latest chipset will include a version with a built-in 5G modem, as well as offering a speed increase compared to its predecessor.

The Kirin 990 will power Huawei’s upcoming flagship smartphone, the Mate 30, which the Chinese firm hopes will rival Apple’s latest iPhones.

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The 7-nm processor includes a modem which Huawei says can offer a maximum download speed of 2.3GBps, and a maximum upload speed of 1.25GBps, alongside eight ARM Cortex CPU cores.

Huawei’s Mate 30 smartphone will be unveiled at a September 19 event in Munich. The launch could be marred by the fact that the US entity list restrictions mean Huawei won’t be able to license Google services.

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